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April 11-12, 2013 in Regensburg (Germany)


Next year we will also offer the opportunity to meet our team and to learn more about our unique non-contact handling technology. Focal topic in 2013 will be handling of thin substrates:

  1. Thin glasses
  2. Foils and Papers
  3. Thin wafers
  4. Battery Cell Stack und Fuel Cell Assembly.

We invite you to join our in-house exhibition in Regensburg (Germany). Besides interesting presentations from R&D, field reports from our customers we will also present our latest developments and products.


If you want to pre-register (without any committment) and receive further information e.g. about agenda, accommodation please send us an e-Mail. >>>

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