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Semiconductor Wafer-End-Effector |
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Données techniques | ||
Electrical Equipment | 30 W, 230 / 110 V | |
Surface materials available | Anodized aluminum | |
teflon-coated aluminum | ||
Weight | quarz-glass | |
Distance (tool-substrate) | 1700 g | |
Substrate sizes | 100 μm | |
4–18” /100–450 mm | ||
Avantages
- The ultrasound air bearing technology offers a series of benefits compared to state-of-the-art solutions.
- No surface damages due to non-contact handling
- No particle deposition, no influence on your clean room conditions
- High planarity of the substrate during transfer process
Applications
- Loading /Unloading
- Gripping
- Flipping
Aspects originals
- No mechanical contact between handling-device and wafer
- Handling at processed/coated surfaces
- Top-side handling (special design)
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