„NUMBER ONE“ IN CONTACTLESS ULTRASOUND HANDLING

„NUMBER ONE“ IN CONTACTLESS ULTRASOUND HANDLING

„NUMBER ONE“ IN CONTACTLESS ULTRASOUND HANDLING

zs-handling LinearLeviInspektionsmodul

LinearLevi-Inspectionmodule

CONTACTLESS INSPECTION OF SUBSTRATES

 

The LinearLevi-Inspectionmodule enables the inspection of substrates during the contactless transport. It is possible to check the quality of battery cells, foils, packaging, as well as wafer and chips without interrupting the transfer process.

There is the opportunity to subsequently sort the substrates according to the inspection results. The application can be delivered in different versions. For example, combinations with the UltraLevi-Desk for contactless transport are possible.

No scratches on the substrate during the transport

The substrate is kept at a distance, which prevents points of contact.

Features of the LinearLevi-Inspectionmodule:

  • Stackable
  • Various sizes
  • Customizable according to customer specifications

Applications

Batterie- und Brennstoffzellen Folien Verpackung Wafer und Chips

Processes

inspizieren

Further information
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