Contactless.
Ultra-clean.
Precise.
The unique air bearing technology for semiconductor, advanced packaging and ultra-thin glass applications.
- No surface contact
- Ultra-clean air bearing technology
- No air turbulence
- Designed for sensitive substrates
Our unique air bearing principle
- Not Bernoulli-based
- Prevents particle re-deposition
- Extremely stable levitation
- Suitable for particle-sensitive environments
- Low energy consumption
- Eliminates surface contact
- Minimized mechanical stress
- Customer-specific solutions
- Suitable for ultrathin substrates
For the Semiconductor Industry
- Wafer Handling 6", 8", 12"
- DIE Handling
- Supported Materials: Silicon, SiC, GaN, Germanium, Glass
- Advanced Packaging
- Hybrid Bonding
- FlipChip
- Deposition
- Inspection
For Ultra-Thin Glass
- Breakage-free handling
- No mechanical stress
- No surface damage
- Ideal for displays
- Ideal for optics
- Inspection and Metrology