
- Our handling equipment only requires electronic power supply and (in case of overhead handling) underpressure/vacuum.
- By avoiding any surface contact the sensitive substrates are not damaged by microscratches, micro-cracks or contamination.
- Because no additional air is injected, our systems cause no disturbance of the laminar air-flow within a clean-room environment.
- In comparison to "traditional air-bearings" the operating costs are reduced, due to the avoidance of air-cleaning and -supply.
- There is only a small maintainance effort.
- The control interface allows a very good and simple system monitoring.
- Our technology is compatible with any kind of process gas.
- Thin and flexible substrates can be flattened during the handling process in order to reach a high surface evenness.
- Topside handling of textured or coated surfaces is possible without any contact.
- Process and machine design becomes more flexible due to these mentioned handling possibilities.