CONTACTLESS HANDLING OF WAFERS
The modular Waferhandling-System facilitates all possible handling processes of wafers.
Loading and unloading, conveying, gripping, inspecting, sorting and singulating can be realized in one system.
No contact with the wafer during the handling in the system
Our Ultrasonic Suspension Technology keeps the wafer on distance the whole time and therefore prevents micro-scratches and contamination.
Features of the Modular Waferhandling-System:
- Modular Design
- Suitable for clean rooms
- Customizable according to customer specifications
- Linking various processes in one system